NJL5902R-2 - 1 ? 28.jan.2010 rev.1.2 cobp photo reflector general description the NJL5902R-2 is the compact surface mount type photo reflector, which is permitted the lead(pb)-free reflow soldering (260 , 2 times). the NJL5902R-2 has realized the compact package compared with conventional product/njl5902r-1. features ? miniature, thin package : 1.2mm 1.7mm 0.6mm ? low operating dark current : 0.5 a max. ? pb free solder re-flowing permitted : 260 c, 2times ? built-in visible light cut-off filter applications ? detecting the location of lens unit for cellular phone?s camera module ? detecting the watch hand for radio controlled watch ? detecting the location of cd/dvd optical pickup head ? detecting the rotation of various motors ? paper edge detection and mechanism timing detection of facsimile, copy machine etc absolute maximum ratings (ta=25 c) parameter symbol ratings unit emitter forward current (continuous) reverse voltage (continuous) power dissipation i f v r p d 20 6 45 ma v mw detector collector-emitter voltage emitter-collector voltage collector current collector power dissipation v ceo v eco i c p c 16 6 10 25 v v ma mw coupled total power dissipation operating temperature storage temperature reflow soldering temperature p tot t opr t stg t sol 60 -30 to +85 -40 to +100 260 mw c c c electro-optical characteristics (ta=25 c) parameter symbol test condition min typ max unit emitter forward voltage reverse current capacitance v f i r c t i f =4ma v r =6v v r =0v,f=1mhz 0.9 ? ? ? ? 25 1.3 10 ? v a pf detector dark current collector-emitter voltage i ceo v ceo v ce =10v i c =100 a ? 16 ? ? 0.2 ? a v coupled output current*1 operating dark current *2 rise time fall time i o i ceod t r t f i f =4ma,v ce =2v,d=0.7mm i f =4ma,v ce =2v i o =100 a,v ce =2v,rl=1k ,d=0.7mm i o =100 a,v ce =2v,rl=1k ,d=0.7mm 62 ? ? ? ? ? 20 20 155 0.5 ? ? a a s s *1 refer to output current test condition *2 iceod may increase according to the peripher y situation of the surface mounted product.
NJL5902R-2 - 2 ? 28.jan.2010 rev.1.2 a luminum evaporation surface light sealed dark box if io vce if vce iceod ? ? ? c k a e 1.7 (0.8) 1.2 (0.35) (0.35) led center ptx center (0.34) (0.425) 0.6 0.3 (0.15) 0.3 (0.15) 0.45 (0.15) 0.45 (0.15) 0.15 0.15 0.6 0.4 0.6 0.3 0.3 0.3 pcb pattern outline (typ.) unit : mm output current test condition dark current test condition the infrared signal from led is reflected at the aluminum surface ( 0.6mm) 1.3 mm
NJL5902R-2 - 3 ? 28.jan.2010 rev.1.2 a luminum evaporation surface a luminum evaporation surface 0.7mm 0.7mm l=0mm l=0mm direction x direction y response time test condition edge response test condition r l output v cc r d al evaporation surface input t r 50% 90% 10% t d t f t s input output
NJL5902R-2 - 4 ? 28.jan.2010 rev.1.2 power dissipation vs. temperature 0 10 20 30 40 50 60 70 80 90 100 0 20406080100 ambient temperature ta( c) power dissipation p(mw) forward current vs. temperature 0 5 10 15 20 25 30 35 40 45 50 0 20406080100 ambient temperature ta(c) forward current if(ma) forward voltage vs. forward current 1 10 100 0.0 1.0 2.0 forward voltage vf(v) forward current if(ma) forward voltage vs. temperature 0.8 1 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 ambient temperature ta( c) forward voltage vf(v) dark current vs. temperature 0.001 0.01 0.1 1 10 100 1000 -40 -20 0 20 40 60 80 100 ambient temperature ta(c) dark current iceo(na) operating dark current vs. temperature 0.01 0.1 1 10 -40 -20 0 20 40 60 80 100 ambient temperature ta(c) operating dark current iceod( a) typical characteristcs to t a l p o w e r dissipation to t a l p o w e r dissipation collector power dissipation if=20ma if=4ma vce=10v if=4ma , vce=2v
NJL5902R-2 - 5 ? 28.jan.2010 rev.1.2 output current vs. forward current (ta=25 c) 0 50 100 150 200 250 300 350 400 450 500 0246810 forward current if(ma) output current io( a) output current vs. temperature 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 ambient temperature ta( c) relative output current io/io(25 c)(%) output characteristics (ta=25c) 0 50 100 150 200 250 300 350 400 450 500 012345 collector-emitter voltage vce(v) output current io( a) vce saturation (ta=25c) 0.000 0.100 0.200 0.300 0.400 0.500 0.1 1.0 10.0 forward current if(ma) collector-emitter voltage vce(v) output current vs. distance (ta=25c) 0 20 40 60 80 100 120 00.511.522.53 reflector distance d(mm) relative output current io/io(max.)(%) output current vs. edge distance (ta=25c) 0 20 40 60 80 100 120 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 edge distance l(mm) relative output current io/io(max.)(%) if=4ma , vce=2v vce=2v , d=0.7mm if=4ma if=2ma if=6ma if=8ma if=10ma io=50 a io=100 a io=150 a io=200 a if=4ma , vce=2v if=4ma , vce=2v , d=0.7mm direction x direction y
NJL5902R-2 - 6 ? 28.jan.2010 rev.1.2 spectral response (ta=25 c) emitter 0 20 40 60 80 100 120 700 800 900 1000 1100 wavelength (nm) relative response (%) switching time vs. load resistance (ta=25 c) 0.1 1 10 100 0.1 1 10 load resistance rl(k ) switching time t( s) spectral response (ta=25 c) detector 0 20 40 60 80 100 120 500 600 700 800 900 1000 wavelength (nm) relative response (%) attention: please be aware that all data in t he graph are just for reference and not for guarantee. vce=2v , io=100 a tr tf td if=4ma vce=2v , io=100 a tr tf td vce=2v ts
NJL5902R-2 - 7 ? 28.jan.2010 rev.1.2 mounting method note mounting was evaluated with the following prof iles in our company, so there was no problem. however, confirm mounting by the condition of your company beforehand. mounting: twice soldering is allowed. infrared reflow soldering method recommended reflow soldering procedure (note1) using reflow furnace with short wave infrared radiation heater such as halogen lamp regarding temperature profile, please refer to those fo reflow furnace. in this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored mold resin. therefore, please avoid from direct exposure to mold resin. (note2) other method such other methods of soldering as dipping the device into melted solder and vapor phase method (vps) are not appropriate because the body of device will be heated rapidly. therefore, these are not recommended to apply. (note3) the resin gets softened right after soldering, so, the following care has to be taken not to contact the lens surface to anything. not to dip the device into water or any solvents. floe soldering method flow soldering is not possible. iron soldering method iron soldering is not possible. a b c g e 150 c 260 c room te m p . f 180 c 230 c 220 c d a : temperature ramping rate : 1 to 4 c/s b : pre-heating temperature time : 150 to 180 c : 60 to 120s c : temperature ramping rate : 1 to 4 c /s d : 220 c or higher time : shorter than 60s e : 230 c or higher time : shorter than 40s f : peak temperature : lower than 260 c g : temperature ramping rate : 1 to 6 c /s the temperature of the surface of mold package
NJL5902R-2 - 8 ? 28.jan.2010 rev.1.2 cleaning avid washing the device after soldering by reflow method. ic storage conditions and its duration (1) temperature and humidity ranges pack sealing temperature: 5 to 40 [ c] humidity: 40 to 80 [ % ] pack opening temperature: 5 to 40 [ c] humidity: 40 to 60 [ % ] after opening the bag, solder products within 48h. avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge. store the products in the place where it does not create dew with the products due to a sudden change in temperature. (2) when baking, place the reel vertically to avoid load to the side. (3) do not store the devices in corrosive-gas atmosphere. (4) do not store the devices in a dusty place. (5) do not expose the devices to direct rays of the sun. (6) do not allow external forces or loads to be applied to ic?s. (7) be careful because affixed label on the reel might be peeled off when baking. baking in case of keeping expect above condition be sure to apply baking. (heat-resistant tape) baking method: ta=60 c, 48 to 72h, three times baking is allowed ta=100 c, 2 to 6h, three times baking is allowed storage duration within a year after delivering this device. for the products stored longer than a year, confirm their terminals and solderability before they are used. application notes (1) attention in handling treat not to touch the lens surface. avoid dust and any other foreign materials on the lens surface such as point, bonding material, etc. never to apply reverse voltage (vec) of more than 6v on the photo transistor when measuring the characteristics or adjusting the system. if applied, it causes to lower the sensitivity. when mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object.
NJL5902R-2 - 9 ? 28.jan.2010 rev.1.2 a p 1 d 0 w 1 b p 2 p 0 t 1 t w f e d 1 packing specification packing dimentions unit : mm drawing direction insert direction (te1) * carrier tape material : polycarbonate(antistatic) cover tape material : polyester(antistatic) taping strength pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. packaging 1) the taped products are to be rolled up on the taping reel as on the drawing. 2) rolling up specification 2-1) start rolling : carrier tape open space more than 20 pieces. 2-2) end of rolling : carrier tape open space more than 20 pieces, and 2 round of reel space at the cover tape only. 3) taping quantity : 2,000 pieces 4) seal off after putting each reels in a damp proof bag with silica gel. [caution] the specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. the application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. c d e symbol a 180 1.0 b 60 1.0 d 21 0.8 e 2.0 0.5 w0 9.5 0.5 w1 14.5 0.5 dimension c 13 0.2 symbol remarks a 1.35 0.05 bottom dimension b 1.90 0.05 bottom dimension +0.10 0 +0.20 -0.0 e 1.75 0.10 f 3.50 0.05 p0 4.00 0.10 p1 4.00 0.10 p2 2.00 0.05 t0 0. 20 0. 05 t1 0. 76 0. 05 w0 8.00 0.10 w1 5.40 0.10 thickness 0.1max d0 d1 1.00 1.50 dimension
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